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In-Process Wafer Step Height Measurement

Non-contact and non-desctructive optical measuring in the nanonmeter range. During the grinding process the wafer thickness needs to be controlled in real time. A non-contact, optical measurement technology is the ideal solution to monitor the wafer thickness in-process. Optical technology also enables profiling of chip-on-wafer and MEMS during grinding.

Whitepaper Spring 2019

Laser welding using optical coherence tomography

Nowadays the laser is a conventional tool used in industrial manufacturing for a wide variety of applications, from subtractive to additive, from cutting to welding. A major topic in production today is digitalisation and Industry 4.0. In this context the laser is playing a dominant role, because it is possible to produce a part directly from a digital model by contactless processing. This unique feature allows monitoring processes with smart devices, which is a key issue of Industry 4.0.

Spring 2019 - The "Laser User" Magazine

PCB-Separation

PCB-Separation: Controlling ultrashort pulse laser using chromatic-confocal sensors (Depanelling Systems)

Neu-Isenburg, 5.9.2016

When chips are disassembled, a process known as depaneling, precision down to the micrometer is required in both processing and positioning. The depanelling system, built by iC-automation, meets this challenge with a combination of confocal optical measuring sensors and an ultrashort pulse laser made by TRUMPF.


Link Laser Community - The Laser Magazine from TRUMPF.

3D Surface Measuring Machine (Profilometer)

3D Surface Measuring Machines (Profilometer)

Neu-Isenburg (Germany), 4.7.2016

How does the 3D measurement of electronic components work? At first glance, the measuring machines used here look like their relatives from the mechanical world, the high-end coordinate measuring machines. Yet much is different and it starts with the name: We speak of 3D surface measurement systems for microelectronics or microsystems technology, for precision engineering or for the tool industry; and the all-rounders among these can offer several sensor systems. Optical sensors are taking over the lion’s share of the measuring tasks.

Up to four different measuring systems can be found on the sensor carriers of the cyberTECHNOLOGIES 3D surface measurement machines.

Application Story

 

 

Ultrashort-Puls Laser Depaneling of Assembled Circuit Boards

Depaneling circuit boards by means of stamping, mechanical sawing or milling there is a risk of traces of smoke covering the cutting surfaces. This is a sign of thermal stress and high temperatures. Sensitive components can thereby be harmed. Ultrashort-pulse laser systems are prove to be a good alternative. Highly accurate CHRocodile sensors are used to control the focusing of height of the laser for optimal depaneling using ultrashort laser pulses.

 

Ultrakurzpulslaser in der Nutzentrennung
(Article, German)

LASER 01/16  (Trade Magazine, German)

Contactless 3D measurement with latest multi-point sensors

Heye International’s Mark Ziegler and Gerd Schütz discuss the importance of wall thickness measurement in the high speed manufacture of lightweight glass containers and the use of Chrocodile chromatic confocal sensors from Precitec Optronik GmbH in Heye cold end inspection machines.

Contactless 3D measurement with latest multi-point sensors

 

 

[Translate to japanisch:] Interferometrische Messtechnik für die berührungsfreie Dickenmessung an Kunststoffen

[Translate to japanisch:] Völlig neue Messmöglichkeiten ergeben sich durch die interferometrische Messtechnik für die Dickenmessung an Kunststoffen - speziell für die für Kunststoffe überaus wichtigen Materialeigenschaften wie Schichtdicke und Struktur. Ihr großer Vorteil: Sie eignet sie sich fast für alle Kunststoffe, seien sie nun transparent oder opak.

 

Berührungslose Dickenmessung von Kunststoffen

 

Nov 2014 - Zeitschrift "Quality Engineering" - 11/2014

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