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用途 > 光学測定技術 > 半導体産業


 半導体産業における用途は、水平方向にマイクロメーター領域での高解像度、そして垂直方向にはサブマイクロメーター領域での高解像度を必要とします。 インライン品質管理においてセンサーは、ウェーハー厚みの測定、マスク製造における半導体構造の確定ならびに結合状態をチェックします。 さらに、透明コーティングの測定、塗料の厚み確定そして機械的ならびに化学的な研削プロセスをリアルタイムで監視します。 CHRocodileセンサーは酸浴においても、また超真空においても確実に使用することが可能です。

CHRocodile MI5
Quality assurance measurements in the manufacturing process of semiconductors

Many manufacturing processes are dealing with the removal of layers. For example, during wet etching, solid material is converted into liquid compounds with help of a chemical solution. To check the process optical sensors are used. Sensors are used as well to check rinsing processes that allow contaminants to be removed from the wafer surface.

CHRocodile LR
Encapsulation of chips with dispensing machines (dam and fill procedure)

With procedures called dam and fill, first of all a dam made of a viscous cast compound is set up on the circuit board that completely surrounds the chip. Then a dispensing machine dispenses a material to the inner area of the dam that has a low as possible viscosity. This surrounds the delicate structures and wires completely until the component is completely covered. Precitec chromatic confocal sensors measure the height of these chip cast compound dams without touching them accurately to within a few microns. This ensures that the dam height is sufficient for the subsequent cast of the inner area and the protective paint does not run over unprotected areas. The speed of the measuring procedure enables a 100% check of all components manufactured. As a result, casting components is also suitable for high volume, fully automatic manufacturing.

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CHRocodile CLS
Measuring glue beads

In the case of glue beads, they often still rely on a visual inspection. It is important that the glue bead trail is continuous and constant. Several parameters are used as quality criteria that can be determined by optical measuring systems. The glue bead must run in the middle with regard to other structures. Undesirable accumulations of material at the start and end point of the bead can be detected. Even gaps can be detected.

CHRocodile 2 IT TW
Circuit board layer thicknesses

The layer thicknesses of silicon casting compounds or solder resist can be measured. Basically there are two different measuring procedures here, chromatic measuring and interferometric measuring. Silicon casting compound can be measured both chromatically and interferometrically. The layer thickness of coloured solder resist can also be measured with the interferometric measuring method. Here the interferometric method has slight advantages over chromatic measuring because it can tolerate a measuring distance deviation of a few millimeters. A 3D measuring device is required if necessary to adjust the measuring distance so that the measured surface is within the permissible operating range of the measuring head.

CHRocodile CLS
Through Silicon Via (TSV)

Through Silicon Via is a mainly vertical electrical metal connection by a wafer. Here a vertical pile of thinned out individual chips is connected through using small copper structures. After the etching process these protrude a little above the silicon and are known as bumps. The TSV structures before filling – which are holes with a high aspect ratio – and the bumps that occur after filling can themselves be measured with Precitec sensors. The height of the bumps over the silicon structures and the depth of the TSVs are required.

CHRocodile CLS
Chip handling: Chip bonding, OLED & LED chips

Metallic OLED display masks can be measured with the line sensor CHRocodile CLS. Imperfections can be reliably detected here. The sensors are also suitable for the ever more compact LED chip packages for high levels of illumination and small form factors, such as is common for LED background lighting and LC screens. Both cutting profiles and also topographies can be created. When the chips are assembled, Precitec Optronik sensors determine the correct position of chips.

Often individual LED are no longer used but highly integrated chips with a large number of light diodes. When testing these optical chips, contact-free measuring distance sensors are already used to a large extent today. These can measure the height of the LED (Z co-ordinates).


Both high and low doped wafers can be measured to determine the thickness with interferometric measuring systems in the infrared range. Other quality criteria are bowing and warping that are taken into account particularly with very thin wafers. The structures applied in layers can distort wafers. The level of distortion can be determined very accurately with distance sensors.

CHRocodile 2 IT 製品ファミリー

CHRocodile ITファミリーのセンサーは、ウェーハーおよびソラーセルの簡単で同時に高精度な間隔測定および層厚測定を提供しています。この光学センサーは無接触型で、単一測定ヘッドでシリコンを 1 mmの層厚まで測定することができます。 周縁領域にまでいたる精密な厚さ確定は、高品質製品にとって重要な意味を持ちます。 CHRocodile ITは極小測定点をとおしてこれを保証します。 CHRocodile IT ファミリーのセンサーはその他、GaAsウェーハー、不透明フィルムならびに多層システムの測定等の機能を持っています。 その堅牢で簡単な構造によって、生産プロセスへ直接組み込むことが可能です。 勿論、これらの機器は廉価な大量生産用にも、またラボでの高精度な層厚測定にも投入されています。

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