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In-Process Wafer Step Height Measurement

Non-contact and non-desctructive optical measuring in the nanonmeter range. During the grinding process the wafer thickness needs to be controlled in real time. A non-contact, optical measurement technology is the ideal solution to monitor the wafer thickness in-process. Optical technology also enables profiling of chip-on-wafer and MEMS during grinding.

Whitepaper Spring 2019

Laser welding using optical coherence tomography

Nowadays the laser is a conventional tool used in industrial manufacturing for a wide variety of applications, from subtractive to additive, from cutting to welding. A major topic in production today is digitalisation and Industry 4.0. In this context the laser is playing a dominant role, because it is possible to produce a part directly from a digital model by contactless processing. This unique feature allows monitoring processes with smart devices, which is a key issue of Industry 4.0.

Spring 2019 - The "Laser User" Magazine

PCB-Separation

PCB-Separation: Controlling ultrashort pulse laser using chromatic-confocal sensors

Neu-Isenburg (Germany), 5.9.2016

When chips are disassembled, a process known as depaneling, precision down to the micrometer is required in both processing and positioning. The depanelling system, built by iC-automation, meets this challenge with a combination of confocal optical measuring sensors and an ultrashort pulse laser made by TRUMPF.


Link Laser Community - The Laser Magazine from TRUMPF

3D Surface Measuring Machine (Profilometer)

3D Surface Measuring Machines (Profilometer)

Neu-Isenburg (Germany), 4.7.2016

How does the 3D measurement of electronic components work? At first glance, the measuring machines used here look like their relatives from the mechanical world, the high-end coordinate measuring machines. Yet much is different and it starts with the name: We speak of 3D surface measurement systems for microelectronics or microsystems technology, for precision engineering or for the tool industry; and the all-rounders among these can offer several sensor systems. Optical sensors are taking over the lion’s share of the measuring tasks.

Up to four different measuring systems can be found on the sensor carriers of the cyberTECHNOLOGIES 3D surface measurement machines.

Application Story

CHRocodile C.

CHRocodile C – Un nouveau capteur sans contact ultra-compact pour la mesure de distance et d’épaisseur

Le capteur chromatique CHRocodile C avec son design robuste tout intégré de la taille d'un paquet de cigarette offre des mesures de distance et d'épaisseur de très haute précision.

Le CHRocodile C est spécialement dédié pour l'utilisation industrielle en ligne ou une intégration dans les machines d'inspection.

Grâce à sa dimension compacte et son excellent rapport qualité/prix, le CHRocodile C est une alternative idéale au capteur à triangulation laser

 

COMMUNIQUE DE PRESSE

Ultrashort-Puls Laser Depaneling of Assembled Circuit Boards

Depaneling circuit boards by means of stamping, mechanical sawing or milling there is a risk of traces of smoke covering the cutting surfaces. This is a sign of thermal stress and high temperatures. Sensitive components can thereby be harmed. Ultrashort-pulse laser systems are prove to be a good alternative. Highly accurate CHRocodile sensors are used to control the focusing of height of the laser for optimal depaneling using ultrashort laser pulses.

Ultrakurzpulslaser in der Nutzentrennung
(Article, German)

LASER 01/16  (Trade Magazine, German)

Mesure 3D sans contact avec les derniers capteurs optiques multi-points

Mark Ziegler et Gerd Schütz de Heye International échangent sur l’importance des mesures d’épaisseur de paroi dans la fabrication haute cadence de verre creux et de l’utilisation des capteurs confocaux chromatiques CHRocodile de Precitec Optronik chez Heye dans leur machine d’inspection « bout froid ».

Mesure 3D sans contact avec les derniers capteurs optiques multi-points 

 

 

 

 

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